MULTIFUNCTION PERIPHERAL, PBGA500

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Produktinfodermation

Terminal Finish	TIN LEAD
Terminal Pitch	1.27 mm
Terminal Foderm	BALL
Operating Temperature-Max	85 Cel
Width	40 mm
Clock Frequency-Max	66 MHz
Qualification Status	COMMERCIAL
JESD-609 Code	e0
Package Shape	SQUARE
Temperature Grade	INDUSTRIAL
Status	Contact Mfr
Operating Temperature-Min	-40 Cel
Package Body Material	PLASTIC/EPOXY
Supply Voltage-Max	3.6 V
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage-Nom	3.3 V
REACH Compliant	Yes
Moisture Sensitivity Level	NOT SPECIFIED
Package Code	LBGA
External Data Bus Width	64
Boundary Scan	NO
Length	40 mm
Address Bus Width	64
Supply Voltage-Min	3 V
Surface Mount	YES
Mfr Package Description	40 X 40 MM, HEAT SINK, TBGA-500
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of Terminals	500
Number of I/O Lines	7
Seated Height-Max	1.7 mm
JESD-30 Code	S-PBGA-B500
Terminal Position	BOTTOM
Bus Compatibility	PCI; 68000; VR5000
Package Style	GRID ARRAY, LOW PROFILE

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