CONN IC DIP SOCKET 20POS GOLD

El producto real puede diferir de la imagen mostrada

Infomación del Producto

Categoy	Conectoes, interconexiones
Contact Resistance	20 mOhm
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions o Pins (Grid)	20 (2 x 10)
Contact Finish Thickness - Post	Flash
Mounting Type	Through Hole
Contact Material - Mating	Beryllium Copper
Contact Finish - Mating	Gold
Type	DIP, 0.3" (7.62mm) Row Spacing
Datasheets	XR2
Standard Package	24
Other Related Documents	How to Read Date Codes
Contact Material - Post	Beryllium Copper
Material Flammability Rating	UL94 V-0
Associated Product	OR1088-ND - CONN SOCKET CLAMP FOR IC SOCKETS XR2Z-11-ND - CONN SOCKET CLAMP FOR IC SOCKETS
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame, Seal Tape
Family	Sockets fo ICs, Transistos
Termination Post Length	0.138" (3.50mm)
Series	XR2
Packaging	Bulk
Contact Finish Thickness - Mating	Flash
Contact Finish - Post	Gold
Other Names	XR2T2021N
Pitch - Post	0.100" (2.54mm)

Ofrezca su precio aceptable y podemos satisfacerlo.Tu precio deseado