CONN IC DIP SOCKET 8POS GOLD

The actual product may differ from image shown

Product Information

Category	Connectors, Interconnects
Contact Resistance	20 mOhm
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions or Pins (Grid)	8 (2 x 4)
Contact Finish Thickness - Post	Flash
Mounting Type	Through Hole
Contact Material - Mating	Beryllium Copper
Contact Finish - Mating	Gold
Type	DIP, 0.3" (7.62mm) Row Spacing
Datasheets	XR2
Standard Package	60
Other Related Documents	How to Read Date Codes
Contact Material - Post	Beryllium Copper
Material Flammability Rating	UL94 V-0
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame
Family	Sockets for ICs, Transistors
Termination Post Length	-
Series	XR2
Packaging	Bulk
Contact Finish Thickness - Mating	Flash
Contact Finish - Post	Gold
Other Names	XR2A0825
Pitch - Post	0.100" (2.54mm)

Offer your acceptable price, and we may make you satisfied.Your Target Price