CONN IC DIP SOCKET 24POS GOLD

The actual product may differ from image shown

Product Information

Category	Connectors, Interconnects
Contact Resistance	20 mOhm
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions or Pins (Grid)	24 (2 x 12)
Contact Finish Thickness - Post	29.5 in (0.75 m)
Contact Material - Mating	Beryllium Copper
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Mating	Gold
Datasheets	XR2
Standard Package	50
Other Related Documents	How to Read Date Codes
Contact Material - Post	Beryllium Copper
Family	Sockets for ICs, Transistors
Material Flammability Rating	UL94 V-0
PCN Obsolescence/ EOL	XR2D/XR2E Series Apr/2012
Associated Product	OR1088-ND - CONN SOCKET CLAMP FOR IC SOCKETS XR2Z-11-ND - CONN SOCKET CLAMP FOR IC SOCKETS
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Carrier
Mounting Type	Through Hole
Termination Post Length	-
Series	XR2
Packaging	Bulk
Contact Finish Thickness - Mating	29.5 in (0.75 m)
Contact Finish - Post	Gold
Other Names	XR2D2401N
Pitch - Post	0.100" (2.54mm)

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