SPECIALTY MEMORY CIRCUIT, PBGA66

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Product Information

Terminal Finish	TIN LEAD
Terminal Pitch	0.8000 mm
Terminal Form	BALL
Operating Temperature-Max	85 Cel
Number of Words Code	1M
Supply Voltage-Nom (Vsup)	3 V
Temperature Grade	INDUSTRIAL
Package Shape	RECTANGULAR
Status	DISCONTINUED
Operating Temperature-Min	-40 Cel
Number of Words	1.05E6 words
Package Body Material	PLASTIC/EPOXY
Number of Functions	1
Memory Density	1.68E7 deg
Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	2.7 V
Organization	1M X 16
Memory Width	16
Surface Mount	Yes
Mfr Package Description	11 X 8 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MO-219, FBGA-66
Operating Mode	ASYNCHRONOUS
Number of Terminals	66
Terminal Position	BOTTOM
Technology	CMOS
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH
Memory IC Type	MEMORY CIRCUIT

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