CONN IC DIP SOCKET 20POS GOLD

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Product Information

Category	Connectors, Interconnects
Contact Resistance	20 mOhm
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions or Pins (Grid)	20 (2 x 10)
Contact Finish Thickness - Post	Flash
Mounting Type	Through Hole
Contact Material - Mating	Beryllium Copper
Contact Finish - Mating	Gold
Type	DIP, 0.3" (7.62mm) Row Spacing
Datasheets	XR2
Standard Package	24
Other Related Documents	How to Read Date Codes
Contact Material - Post	Beryllium Copper
Material Flammability Rating	UL94 V-0
Associated Product	OR1088-ND - CONN SOCKET CLAMP FOR IC SOCKETS XR2Z-11-ND - CONN SOCKET CLAMP FOR IC SOCKETS
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Open Frame, Seal Tape
Family	Sockets for ICs, Transistors
Termination Post Length	0.138" (3.50mm)
Series	XR2
Packaging	Bulk
Contact Finish Thickness - Mating	Flash
Contact Finish - Post	Gold
Other Names	XR2T2021N
Pitch - Post	0.100" (2.54mm)

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