CONN IC DIP SOCKET 24POS GOLD

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Infomazioni sul prodotto

Categoy	Connettoi, interconnessioni
Contact Resistance	20 mOhm
Current Rating	1A
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55 C ~ 125 C
Number of Positions o Pins (Grid)	24 (2 x 12)
Contact Finish Thickness - Post	29.5 in (0.75 m)
Contact Material - Mating	Beryllium Copper
Type	DIP, 0.6" (15.24mm) Row Spacing
Contact Finish - Mating	Gold
Datasheets	XR2
Standard Package	50
Other Related Documents	How to Read Date Codes
Contact Material - Post	Beryllium Copper
Family	Sockets fo ICs, Transistos
Material Flammability Rating	UL94 V-0
PCN Obsolescence/ EOL	XR2D/XR2E Series Apr/2012
Associated Product	OR1088-ND - CONN SOCKET CLAMP FOR IC SOCKETS XR2Z-11-ND - CONN SOCKET CLAMP FOR IC SOCKETS
Termination	Solder
Pitch - Mating	0.100" (2.54mm)
Features	Carrier
Mounting Type	Through Hole
Termination Post Length	-
Series	XR2
Packaging	Bulk
Contact Finish Thickness - Mating	29.5 in (0.75 m)
Contact Finish - Post	Gold
Other Names	XR2D2401N
Pitch - Post	0.100" (2.54mm)

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